Via Technologies China Headquarters
Hornberger + Worstell designed this 11 story, 261,000 square foot corporate headquarters for Via Technologies in Beijing, China. The project includes two levels of below grade parking for 97 cars and 280 bicycles, and 50,000 square feet of office space built to international standards. The flexible office space was designed to accommodate the needs of full and partial floor tenants.
The exterior of the tower combines two distinct facades: a hard-edged, stone-clad facade distinguishes the visible addressing corner of Cheng-Fu Road, while a lighter, more transparent facade sets the tone for the more informal southeastern area of the site. The form of the building was designed to architecturally integrate mechanical requirements and to enhance the building’s skyline identity.